Title :
Electrical characterization of a reduced metal layer copper/polymide multi-chip module substrate
Author :
Hashemi, H. ; Sommerfeldt, S. ; Miracky, R.
Author_Institution :
Microelectronics & Computer Technology Corp. (MCC), 12100 Technology Blvd., Austin, TX 78727
Keywords :
Copper; Crosstalk; Frequency; Impedance; Integrated circuit interconnections; Multichip modules; Optical design; Signal design; Substrates; Wiring;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1992
Print_ISBN :
0-7803-0683-X
DOI :
10.1109/EPEP.1992.572253
