DocumentCode

2639061

Title

Electrical characterization of a reduced metal layer copper/polymide multi-chip module substrate

Author

Hashemi, H. ; Sommerfeldt, S. ; Miracky, R.

Author_Institution

Microelectronics & Computer Technology Corp. (MCC), 12100 Technology Blvd., Austin, TX 78727

fYear

1992

fDate

22-24 Apr 1992

Firstpage

19

Lastpage

21

Keywords

Copper; Crosstalk; Frequency; Impedance; Integrated circuit interconnections; Multichip modules; Optical design; Signal design; Substrates; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1992

Print_ISBN

0-7803-0683-X

Type

conf

DOI

10.1109/EPEP.1992.572253

Filename

572253