• DocumentCode
    2639486
  • Title

    Steps toward a sound measure of engineering student attitudes: Pittsburgh Engineering Attitudes Scale - Revised

  • Author

    Hilpert, Jonathan ; Stump, Glenda ; Husman, Jenefer ; Kim, Wonsik ; Chung, Wen-Ting ; Lee, Jieun

  • Author_Institution
    Indiana Univ. Purdue Univ., Fort Wayne, IN, USA
  • fYear
    2009
  • fDate
    18-21 Oct. 2009
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Engineering education is currently undergoing a transition toward increased constructivist practices and a new philosophy of education that recognizes the active role of the learner in constructing knowledge. To meet the demands of the changing landscape, our research team has been reworking the Pittsburgh engineering attitudes scale so that valid and reliable inferences can be made about engineering student attitudes. The current study follows up on our analysis of the scale at FIE 2008, and presents evidence of structural validity, internal reliability, and external validity of student responses to a revised version of the scale. The results of the current study suggest the Pittsburgh engineering attitudes scale - revised overcomes previous problems with the original scale reported in the literature and that we are making positive steps toward a sound measure of student attitudes.
  • Keywords
    engineering education; Pittsburgh engineering attitude scale; engineering education; engineering student attitude; student motivation; Acoustical engineering; Buildings; Collaborative work; Current measurement; Data engineering; Engineering education; Engineering students; Instruments; Knowledge engineering; Reliability engineering; Attitudes; Constructivism; Motivation; Scale Development;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Frontiers in Education Conference, 2009. FIE '09. 39th IEEE
  • Conference_Location
    San Antonio, TX
  • ISSN
    0190-5848
  • Print_ISBN
    978-1-4244-4715-2
  • Electronic_ISBN
    0190-5848
  • Type

    conf

  • DOI
    10.1109/FIE.2009.5350470
  • Filename
    5350470