DocumentCode

2639664

Title

High-aspect-ratio lines as dense off-chip interconnects

Author

Blennemann, Heinz ; Pease, R. Fabian

Author_Institution

Department of Electrical Engineering, Stanford University, Stanford, CA 94305

fYear

1992

fDate

22-24 Apr 1992

Firstpage

28

Lastpage

30

Keywords

Attenuation; Conductors; Crosstalk; Dielectrics; Distortion measurement; Gold; Impedance; Microstrip; Polymers; Stripline;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1992

Print_ISBN

0-7803-0683-X

Type

conf

DOI

10.1109/EPEP.1992.572256

Filename

572256