DocumentCode :
26400
Title :
A TSV-Based Bio-Signal Package With 
-Probe Array
Author :
Lei-Chun Chou ; Shih-Wei Lee ; Po-Tsang Huang ; Chih-Wei Chang ; Cheng-Hao Chiang ; Shang-Lin Wu ; Ching-Te Chuang ; Jin-Chern Chiou ; Wei Hwang ; Chung-Hsi Wu ; Kuo-Hua Chen ; Chi-Tsung Chiu ; Ho-Ming Tong ; Kuan-Neng Chen
Author_Institution :
Nat. Chiao Tung Univ., Hsinchu, Taiwan
Volume :
35
Issue :
2
fYear :
2014
fDate :
Feb. 2014
Firstpage :
256
Lastpage :
258
Abstract :
Bio-signal probes providing stable observation with high quality signals are crucial for understanding how the brain works and how the neural signal transmits. Due to the weak and noisy characteristics of bio-signals, the connected interconnect length between the sensor and CMOS has significant impact on the bio-signal quality. In addition, long interconnections with wire bonding technique introduce noises and lead to bulky packaged systems. This letter presents an implantable through-silicon via (TSV) technology to connect sensors and CMOS devices located on the opposite sides of the chip for brain neural sensing applications. With the elimination of traditional wire bonding and packaging technologies, the quality of bio-signal can be greatly improved.
Keywords :
CMOS integrated circuits; bioMEMS; biosensors; integrated circuit interconnections; three-dimensional integrated circuits; μ-probe array; CMOS devices; TSV-based biosignal package; biosignal probes; brain neural sensing applications; implantable TSV technology; implantable through-silicon via technology; interconnections; neural signal; noises; sensor; wire bonding technique; Arrays; CMOS integrated circuits; Electrical resistance measurement; Etching; Probes; Through-silicon vias; Wires; CMOS MEMS; TSV; bio-signal probe;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2013.2293399
Filename :
6684308
Link To Document :
