Automated inspection of through hole solder joints utilizing X-ray imaging

Author

Pierce, Bennie L. ; Shelton, Daniel J. ; Longbotham, Harold G. ; Baddipudi, Susmitham ; Yan, Ping

Author_Institution

Conceptual MindWorks, Inc., San Antonio, TX, USA

fYear

1993

fDate

20-23 Sep 1993

Firstpage

191

Lastpage

196

Abstract

This paper describes a preliminary, automated inspection system that finds the solder joints in a X-ray image and inspects them using an artificial neural network (ANN). The identification of solder joints in the gray-scale image is done using image processing techniques; CAD data or manual registration of the solder joints is not required. The image processing techniques also yield binary maps (i.e. black and white images) showing the locations of ICs and other components, which is useful for other diagnostics

Keywords

X-ray imaging; automatic test equipment; fault diagnosis; image processing; image processing equipment; inspection; printed circuit testing; self-organising feature maps; soldering; Kohonen network; X-ray imaging; artificial neural network; automated inspection; automatic inspection; binary maps; black and white images; blob coloring; diagnostics; gray-scale image; identification of solder joints; image segmentation; rank order filters; through hole solder joints; Artificial neural networks; Gray-scale; Image processing; Image segmentation; Infrared detectors; Inspection; Manuals; Pixel; Soldering; X-ray imaging;

fLanguage

English

Publisher

ieee

Conference_Titel

AUTOTESTCON '93. IEEE Systems Readiness Technology Conference. Proceedings

Conference_Location

San Antonio, TX

Print_ISBN

0-7803-0646-5

Type

conf

DOI

10.1109/AUTEST.1993.396350

Filename

396350