DocumentCode
2640656
Title
Manufacturing defects testing of a multi-chip-module using IEEE 1149.1 boundary scan test and embedded built-in test software
Author
Round, Brenda J.
Author_Institution
Texas Instruments Inc., Plano, TX, USA
fYear
1993
fDate
20-23 Sep 1993
Firstpage
151
Lastpage
156
Abstract
This paper describes the use of boundary scan based tests and embedded built in test (BIT) software in the manufacturing defects testing of a 100 MHz, high density, surface mount multi-chip-module, parallel processing computer
Keywords
automatic test equipment; boundary scan testing; fault diagnosis; fault location; multichip modules; parallel architectures; production testing; surface mount technology; 100 MHz; ASIC; Aladdin; IEEE 1149.1 boundary scan test; MCM; embedded built-in test software; manufacturing defects testing; parallel processing computer; surface mount multi-chip-module; Application specific integrated circuits; Assembly; Built-in self-test; Circuit testing; Embedded software; Logic testing; Manufacturing; Packaging; Registers; Software testing;
fLanguage
English
Publisher
ieee
Conference_Titel
AUTOTESTCON '93. IEEE Systems Readiness Technology Conference. Proceedings
Conference_Location
San Antonio, TX
Print_ISBN
0-7803-0646-5
Type
conf
DOI
10.1109/AUTEST.1993.396355
Filename
396355
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