• DocumentCode
    2641722
  • Title

    Benchmark structures for modeling and measurement of electronic packaging

  • Author

    Tripathi, Vaibhav

  • Author_Institution
    Oregon State University, Corvailis, OR
  • fYear
    1992
  • fDate
    22-24 Apr 1992
  • Firstpage
    65
  • Lastpage
    65
  • Keywords
    Electronics packaging; Frequency; Integrated circuit interconnections; Large scale integration; Measurement standards; Millimeter wave circuits; Millimeter wave measurements; Millimeter wave technology; Ultra large scale integration; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 1992
  • Print_ISBN
    0-7803-0683-X
  • Type

    conf

  • DOI
    10.1109/EPEP.1992.572266
  • Filename
    572266
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2641722