Title :
Heterogeneous Systems on Chip and Systems in Package
Author :
O´Connor, I. ; Courtois, B. ; Chakrabarty, Krishnendu ; Hampton, M.
Author_Institution :
Ecole Centrale de Lyon
Abstract :
This paper discusses several forms of heterogeneity in systems on chip and systems in package. A means to distinguish the various forms of heterogeneity is given, with an estimation of the maturity of design and modeling techniques with respect to various physical domains. Industry-level MEMS integration, and more prospective microfluidic biochip systems are considered at both technological and EDA levels. Finally, specific flows for signal abstraction heterogeneity in RF SiP and for functional co-verification are discussed
Keywords :
microfluidics; radiofrequency integrated circuits; system-in-package; system-on-chip; MEMS integration; RF SiP; maturity estimation design techniques; maturity estimation modeling techniques; microfluidic biochip systems; signal abstraction heterogeneity; systems in package; systems on chip; Computational modeling; Electronic design automation and methodology; Hardware; III-V semiconductor materials; Integrated circuit modeling; Micromechanical devices; Packaging; Radio frequency; Silicon; System-on-a-chip;
Conference_Titel :
Design, Automation & Test in Europe Conference & Exhibition, 2007. DATE '07
Conference_Location :
Nice
Print_ISBN :
978-3-9810801-2-4
DOI :
10.1109/DATE.2007.364683
