DocumentCode
2642572
Title
IC packages capacitance calculations using finite element method
Author
Chou, Tai-Yu ; Cendes, Zoltan J.
Author_Institution
Ansoft Corporation, Pittsburgh, PA 15219
fYear
1992
fDate
22-24 Apr 1992
Firstpage
76
Lastpage
78
Keywords
Capacitance; Central Processing Unit; Finite difference methods; Finite element methods; Geometry; Integrated circuit interconnections; Integrated circuit packaging; Plastic integrated circuit packaging; Poisson equations; Sparse matrices;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1992
Print_ISBN
0-7803-0683-X
Type
conf
DOI
10.1109/EPEP.1992.572270
Filename
572270
Link To Document