• DocumentCode
    2642809
  • Title

    High Power Microwave Window Design

  • Author

    Bassett, H.L. ; Schuchardt, J.M. ; Colwell, G.T. ; Smith, B.L.

  • Volume
    74
  • Issue
    1
  • fYear
    1974
  • fDate
    12-14 June 1974
  • Firstpage
    145
  • Lastpage
    148
  • Abstract
    The design of a heat-pipe cooled microwave waveguide window will be presented in this paper. The window is capable of handling megawatts of RF power in S-band (2.6 - 4.0 GHz) waveguide. The thickness and spacing of the windows, the window material characteristics, the thermal analysis of the heat pipe and the power handling capability will be addressed. The use of this technique in cooling other microwave components is discussed
  • Keywords
    Bonding; Conducting materials; Cooling; Copper; Electromagnetic heating; Microwave theory and techniques; Radio frequency; Space heating; Testing; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 1974 S-MTT International
  • Conference_Location
    Atlanta, Georgia, USA
  • Type

    conf

  • DOI
    10.1109/MWSYM.1974.1123514
  • Filename
    1123514