A 77GHz automotive radar receiver in a wafer level package

Author

Wagner, Christoph ; Böck, Josef ; Wojnowski, Maciej ; Jäger, Herbert ; Platz, Johannes ; Treml, Markus ; Dober, Florian ; Lachner, Rudolf ; Minichshofer, Jürgen ; Maurer, Linus

Author_Institution

Danube Integrated Circuit Eng., Linz, Austria

fYear

2012

fDate

17-19 June 2012

Firstpage

511

Lastpage

514

Abstract

In this paper, a 77-GHz radar receiver is presented, which comes in a wafer level package and thus eliminates the need for wire bonding yielding significant cost reduction. The high integration level available in the productive Silicon-Germanium (SiGe) technology used in this paper allows for implementation of in-system monitoring of the receiver conversion parameters. This facilitates the realization of ISO 26262 compliant radar sensors for automotive safety applications.

Keywords

Ge-Si alloys; ISO standards; cost reduction; lead bonding; microwave receivers; radar receivers; road vehicle radar; sensors; wafer level packaging; ISO compliant radar sensor; SiGe; automotive radar receiver; automotive safety application; cost reduction; frequency 77 GHz; in-system monitoring; receiver conversion parameter; wafer level packaging; wire bonding; Automotive engineering; Radar; Radio frequency; Receivers; Sensors; Silicon; Silicon germanium; 77-GHz; BITE; SiGe technology; automotive radar; eWLB package;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio Frequency Integrated Circuits Symposium (RFIC), 2012 IEEE

Conference_Location

Montreal, QC

ISSN

1529-2517

Print_ISBN

978-1-4673-0413-9

Electronic_ISBN

1529-2517

Type

conf

DOI

10.1109/RFIC.2012.6242334

Filename

6242334