A MCM-L package with LCP core for millimeter-wave active integrated antennas

Author

Merkle, T. ; Smith, S.

Author_Institution

ICT Centre, CSIRO, Epping, NSW, Australia

fYear

2009

fDate

1-5 June 2009

Firstpage

1

Lastpage

4

Abstract

A laminated multi-chip module (MCM-L) process has been developed with focus on integrating planar antennas and monolithic microwave integrated circuits (MMICs) at E-band (71-86 GHz). The antenna and interconnection substrate is composed of liquid crystal polymer (LCP). Edge-fed patch antennas on GaAs and slot-coupled antennas that couple from a GaAs chip to a patch antenna on LCP are presented. The edge-fed antenna can also be used to couple to a secondary patch on an LCP board located above the chip.

Keywords

MMIC; liquid crystal polymers; microstrip antennas; millimetre wave devices; multichip modules; planar antennas; slot antennas; LCP; MCM-L package; edge-fed patch antennas; laminated multi-chip module; liquid crystal polymer; millimeter-wave active integrated antennas; monolithic microwave integrated circuits; planar antennas; slot-coupled antennas; Coupling circuits; Gallium arsenide; Integrated circuit interconnections; Integrated circuit packaging; MMICs; Microwave integrated circuits; Millimeter wave integrated circuits; Monolithic integrated circuits; Patch antennas; Planar arrays;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium, 2009. APSURSI '09. IEEE

Conference_Location

Charleston, SC

ISSN

1522-3965

Print_ISBN

978-1-4244-3647-7

Type

conf

DOI

10.1109/APS.2009.5171487

Filename

5171487