Title :
Electromagnetic characterization of MCM interconnects
Author :
Gribbons, M. ; Cangellaris, A.C.
Author_Institution :
Center for Electronic Packaging Research, Department of Electrical and Computer Engineering, University of Arizona, Tucson, AZ 85721
Keywords :
Electromagnetic modeling; Electronics packaging; Frequency; Impedance; Maxwell equations; Metallization; Periodic structures; Power system interconnection; Strips; Voltage;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1992
Print_ISBN :
0-7803-0683-X
DOI :
10.1109/EPEP.1992.572275
