DocumentCode
2643463
Title
Electromagnetic characterization of MCM interconnects
Author
Gribbons, M. ; Cangellaris, A.C.
Author_Institution
Center for Electronic Packaging Research, Department of Electrical and Computer Engineering, University of Arizona, Tucson, AZ 85721
fYear
1992
fDate
22-24 Apr 1992
Firstpage
93
Lastpage
95
Keywords
Electromagnetic modeling; Electronics packaging; Frequency; Impedance; Maxwell equations; Metallization; Periodic structures; Power system interconnection; Strips; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1992
Print_ISBN
0-7803-0683-X
Type
conf
DOI
10.1109/EPEP.1992.572275
Filename
572275
Link To Document