DocumentCode
2644042
Title
Determination of Semiconductor Junction Device Package Networks
Author
Greiling, P.T. ; Laton, R.W.
Volume
74
Issue
1
fYear
1974
fDate
12-14 June 1974
Firstpage
303
Lastpage
305
Abstract
A general method for the determination of a linear, lumped-element equivalent circuit of any semiconductor device package in any microwave circuit mount is presented. Results are given for IMPATT and TRAPATT devices in coaxial and microstrip circuits, together with experimental validation of the results.
Keywords
Coaxial components; Electromagnetic heating; Equivalent circuits; Impedance measurement; Microstrip; Microwave circuits; Microwave devices; Microwave theory and techniques; Semiconductor device packaging; Semiconductor devices;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1974 S-MTT International
Conference_Location
Atlanta, Georgia, USA
Type
conf
DOI
10.1109/MWSYM.1974.1123582
Filename
1123582
Link To Document