Design Challenges at 65nm and Beyond

Author

Kahng, Andrew B.

Author_Institution

California Univ., San Diego, CA

fYear

2007

fDate

16-20 April 2007

Firstpage

1

Lastpage

2

Abstract

Semiconductor manufacturing technology faces ever-greater challenges of pitch, mobility, variability, leakage, and reliability. To enable cost-effective continuation of the semiconductor roadmap, there is greater need for design technology to provide "equivalent scaling", and for product-specific design innovation (multi-core architecture, software support, beyond-die integration, etc.) to provide "more than Moore" scaling. Design challenges along the road to 45nm include variability and power management, and leverage of design-manufacturing synergies. Potential solutions include "design for manufacturability" bridges between chip implementation and manufacturing know-how

Keywords

design for manufacture; semiconductor device manufacture; system-on-chip; 45 nm; 65 nm; chip implementation; design for manufacturability; design manufacturing synergies; equivalent scaling; power management; product specific design innovation; semiconductor manufacturing technology; variability; Copper; Etching; Fluctuations; Integrated circuit interconnections; Leakage current; Manufacturing; Semiconductor device manufacture; Semiconductor device reliability; Stress; Threshold voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Design, Automation & Test in Europe Conference & Exhibition, 2007. DATE '07

Conference_Location

Nice

Print_ISBN

978-3-9810801-2-4

Type

conf

DOI

10.1109/DATE.2007.364505

Filename

4212015