• DocumentCode
    2644290
  • Title

    Near-field wireless connection for 3D-system integration

  • Author

    Kuroda, Tadahiro

  • Author_Institution
    Keio Univ., Yokohama, Japan
  • fYear
    2012
  • fDate
    12-14 June 2012
  • Firstpage
    105
  • Lastpage
    106
  • Abstract
    This paper describes a wireless inter-chip link using inductive coupling, namely ThruChip Interface (TCI). TCI is a digital CMOS circuit solution in a standard CMOS technology. It is less expensive than TSV but bears comparison in performance.
  • Keywords
    CMOS integrated circuits; radiofrequency integrated circuits; three-dimensional integrated circuits; 3D-system integration; CMOS circuit solution technology; TCI; TSV; ThruChip interface; inductive coupling; near-field wireless connection; wireless inter-chip link; Bandwidth; CMOS integrated circuits; Coils; Couplings; Through-silicon vias; Very large scale integration; Wireless communication; 3D IC; inductive coupling; near field;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology (VLSIT), 2012 Symposium on
  • Conference_Location
    Honolulu, HI
  • ISSN
    0743-1562
  • Print_ISBN
    978-1-4673-0846-5
  • Electronic_ISBN
    0743-1562
  • Type

    conf

  • DOI
    10.1109/VLSIT.2012.6242483
  • Filename
    6242483
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2644290