DocumentCode
2644556
Title
The Real World of MIC Packaging [panel discussions]
Author
Rosenbaum, F.J.
Volume
74
Issue
1
fYear
1974
fDate
12-14 June 1974
Firstpage
328
Lastpage
328
Abstract
Lists panel discussions held at the conference proceedings.
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1974 S-MTT International
Conference_Location
Atlanta, Georgia, USA
Type
conf
DOI
10.1109/MWSYM.1974.1123616
Filename
1123616
Link To Document