DocumentCode :
2645964
Title :
An integrated flow for technology remapping and placement of sub-half-micron circuits
Author :
Lou, Jinan ; Salek, Amir H. ; Pedram, Massoud
Author_Institution :
Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
fYear :
1998
fDate :
10-13 Feb 1998
Firstpage :
295
Lastpage :
300
Abstract :
This paper presents a new design flow, FPD-SiMPA, and a set of techniques for synthesizing high-performance sub-half micron logic circuits. FPD-SiMPA consists of logic partitioning, floorplanning, global routing, and timing analysis/budgeting steps, followed by technology remapping and detailed placement of the selected logic clusters. The strength of the approach lies in the dynamic programming-based algorithm, SiMPA-D, used for performing simultaneous technology mapping and linear placement of logic clusters. This algorithm generates a set of solutions for each cluster, all of which are noninferior (in terms of gate area, cutwidth and delay), and hence permits trade-offs between total area (gate plus wiring) and total delay (gate plus wiring). Experimental results from a large number of MCNC benchmarks have proved the effectiveness of the proposed flow
Keywords :
circuit layout CAD; dynamic programming; logic circuits; logic partitioning; timing; FPD-SiMPA; budgeting steps; dynamic programming-based algorithm; floorplanning; global routing; integrated flow; linear placement; logic circuits; logic partitioning; placement; simultaneous technology mapping; sub-half-micron circuits; technology remapping; timing analysis; total area; total delay; Clustering algorithms; Delay; Heuristic algorithms; Integrated circuit synthesis; Integrated circuit technology; Logic circuits; Partitioning algorithms; Routing; Timing; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference 1998. Proceedings of the ASP-DAC '98. Asia and South Pacific
Conference_Location :
Yokohama
Print_ISBN :
0-7803-4425-1
Type :
conf
DOI :
10.1109/ASPDAC.1998.669472
Filename :
669472
Link To Document :
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