• DocumentCode
    2646646
  • Title

    Circuit modeling of high speed packages from TDR/T measurements

  • Author

    Jong, J.M. ; Tripathi, V.K. ; Janko, B. ; Smith, D.H.

  • Author_Institution
    Department of Electrical and Computer Engineering, Oregon State University, Corvallis, OR 97331
  • fYear
    1992
  • fDate
    22-24 Apr 1992
  • Firstpage
    154
  • Lastpage
    157
  • Keywords
    Circuit simulation; Crosstalk; Delay effects; Distortion measurement; Fixtures; Integrated circuit interconnections; Integrated circuit modeling; Integrated circuit packaging; Transmission line measurements; Velocity measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 1992
  • Print_ISBN
    0-7803-0683-X
  • Type

    conf

  • DOI
    10.1109/EPEP.1992.572292
  • Filename
    572292
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2646646