DocumentCode :
2646646
Title :
Circuit modeling of high speed packages from TDR/T measurements
Author :
Jong, J.M. ; Tripathi, V.K. ; Janko, B. ; Smith, D.H.
Author_Institution :
Department of Electrical and Computer Engineering, Oregon State University, Corvallis, OR 97331
fYear :
1992
fDate :
22-24 Apr 1992
Firstpage :
154
Lastpage :
157
Keywords :
Circuit simulation; Crosstalk; Delay effects; Distortion measurement; Fixtures; Integrated circuit interconnections; Integrated circuit modeling; Integrated circuit packaging; Transmission line measurements; Velocity measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 1992
Print_ISBN :
0-7803-0683-X
Type :
conf
DOI :
10.1109/EPEP.1992.572292
Filename :
572292
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2646646
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