DocumentCode
2647677
Title
Voltage and temperature effects of denox in dbd plasma generated by an intermittent power source
Author
Yukimura, K. ; Murakami, H. ; Mitsuyoshi, K. ; Itoh, Masayuki ; Levchenko, I.
Author_Institution
Dept. of Electr. Eng., Doshisha Univ., Kyoto
fYear
2006
fDate
4-8 June 2006
Firstpage
203
Lastpage
203
Abstract
Summary form only given. We have developed a direct NO decomposition system using an intermittent power source, where NO is decomposed in a DBD plasma generated by an intermittent sinusoidal power source. The effects of applied voltage to generate a DBD plasma and gas temperature to the DeNOx rate are mainly investigated. This research is based on the ammonia radical injection DeNOx method using a same intermittent pulse power source. The consumed energy shows a linear increase with the applied voltage under the experimental conditions. The DeNOx starts near at an applied voltage of 18 kV for NO/N2 mixed gas, while the DeNOx initiates at 10-14 kV, when argon or argon diluted ammonia gases are added to NO/N2 gas flow field. Thus, the additive gas lowered the DeNOx initiation voltage. This means that NO is decomposed more efficiently by mixing these gases to the NO/N 2 gas. Furthermore, ammonia containing gas is more effective for DeNOx rate than argon gas. The gas temperature significantly influences the DeNOx rate, i.e., at an elevated temperature at 300 C, DeNOx is seen at lower applied voltage even for NO/N2 gas without the additive gas. The plasma reactor consists of a pair of coaxial electrodes with an outer diameter of 64 mm and a gap length of 1.5 mm. Both electrodes are covered with cylindrical quartz tubes. The effective plasma length is 350 mm. The system is in an electric furnace to elevate the gas temperature. The NO concentration is 1000 ppm with a flow rate of 1 L/min. The gas temperate is increased from room temperature to 300 C, and the voltage is increased up to 30 kVp-p
Keywords
dissociation; free radical reactions; gas mixtures; nitrogen; nitrogen compounds; plasma applications; plasma chemistry; plasma sources; plasma temperature; 1.5 mm; 10 to 14 kV; 300 C; 350 mm; 64 mm; NO-N2-Ar; ammonia radical injection; coaxial electrodes; cylindrical quartz tubes; direct NO decomposition; electric furnace; gas temperature; intermittent sinusoidal power source; plasma reactor; room temperature; Additives; Argon; Electrodes; Fluid flow; Gases; Inductors; Plasma sources; Plasma temperature; Power generation; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Plasma Science, 2006. ICOPS 2006. IEEE Conference Record - Abstracts. The 33rd IEEE International Conference on
Conference_Location
Traverse City, MI
Print_ISBN
1-4244-0125-9
Type
conf
DOI
10.1109/PLASMA.2006.1707075
Filename
1707075
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