• DocumentCode
    2648139
  • Title

    Variation RLC model of interconnect based on weibull distribution

  • Author

    Jianwei, Li ; Yintang, Yang ; Gang, Dong ; Zeng, Wang

  • Author_Institution
    Key Lab. of Minist. of Educ. for Wide Band-Gap Semicond. Mater. & Devices, Xidian Univ., Xi´´an, China
  • fYear
    2009
  • fDate
    20-23 Oct. 2009
  • Firstpage
    1240
  • Lastpage
    1243
  • Abstract
    Based on Weibull distribution, a statistical RLC model considering process variations for the efficient analysis interconnect delay is proposed. The statistical RLC model can be used for optimizations, like placement, interconnect synthesis and static timing analysis (STA). Although some delay models of interconnect have been presented, like Elmore, equivalent Elmore, D2M and WED, some of them have not considered the effects of inductances and every one of them have not considered the process variations. The model proposed in this paper has considered all of them. The effectiveness of the proposed model is proved through experimental results. Compared with HSPICE, the result show that the error of 50% delay is less than 1%, the error of mean and the error of the average deviation in Monte Carlo analysis are less than 1%.
  • Keywords
    Monte Carlo methods; SPICE; Weibull distribution; integrated circuit interconnections; integrated circuit modelling; optimisation; HSPICE; Monte Carlo analysis; Weibull distribution; equivalent Elmore; interconnect delay; interconnect synthesis; optimizations; static timing analysis; statistical RLC model; Delay effects; Electronic mail; Integrated circuit interconnections; Integrated circuit modeling; Laboratories; Monte Carlo methods; RLC circuits; Shape; Timing; Weibull distribution; Process variations; RLC interconnect delay; Statistical model; Weibull distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC, 2009. ASICON '09. IEEE 8th International Conference on
  • Conference_Location
    Changsha, Hunan
  • Print_ISBN
    978-1-4244-3868-6
  • Electronic_ISBN
    978-1-4244-3870-9
  • Type

    conf

  • DOI
    10.1109/ASICON.2009.5351207
  • Filename
    5351207