DocumentCode
2648139
Title
Variation RLC model of interconnect based on weibull distribution
Author
Jianwei, Li ; Yintang, Yang ; Gang, Dong ; Zeng, Wang
Author_Institution
Key Lab. of Minist. of Educ. for Wide Band-Gap Semicond. Mater. & Devices, Xidian Univ., Xi´´an, China
fYear
2009
fDate
20-23 Oct. 2009
Firstpage
1240
Lastpage
1243
Abstract
Based on Weibull distribution, a statistical RLC model considering process variations for the efficient analysis interconnect delay is proposed. The statistical RLC model can be used for optimizations, like placement, interconnect synthesis and static timing analysis (STA). Although some delay models of interconnect have been presented, like Elmore, equivalent Elmore, D2M and WED, some of them have not considered the effects of inductances and every one of them have not considered the process variations. The model proposed in this paper has considered all of them. The effectiveness of the proposed model is proved through experimental results. Compared with HSPICE, the result show that the error of 50% delay is less than 1%, the error of mean and the error of the average deviation in Monte Carlo analysis are less than 1%.
Keywords
Monte Carlo methods; SPICE; Weibull distribution; integrated circuit interconnections; integrated circuit modelling; optimisation; HSPICE; Monte Carlo analysis; Weibull distribution; equivalent Elmore; interconnect delay; interconnect synthesis; optimizations; static timing analysis; statistical RLC model; Delay effects; Electronic mail; Integrated circuit interconnections; Integrated circuit modeling; Laboratories; Monte Carlo methods; RLC circuits; Shape; Timing; Weibull distribution; Process variations; RLC interconnect delay; Statistical model; Weibull distribution;
fLanguage
English
Publisher
ieee
Conference_Titel
ASIC, 2009. ASICON '09. IEEE 8th International Conference on
Conference_Location
Changsha, Hunan
Print_ISBN
978-1-4244-3868-6
Electronic_ISBN
978-1-4244-3870-9
Type
conf
DOI
10.1109/ASICON.2009.5351207
Filename
5351207
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