Steady-state thermal simulation of ICs based on SKILL language and finite element method

Author

Bin, Zhang ; Shiwei, Feng ; Rong, Su ; Guangchen, Zhang

Author_Institution

Coll. of Electron. Inf. & Control Eng., Beijing Univ. of Technol., Beijing, China

Volume

7

fYear

2010

fDate

16-18 April 2010

Abstract

In this paper, a new method which combines SKILL language with finite element method is presented. The analysis of steady-state thermal simulation of analog circuit designed by Cadence design software is made by this method. Electronic parameters and equivalent thermal resistances of devices can be obtained by Cadence circuit simulation software and finite element analysis software-ANSYS. Then the temperature rise of the device in circuit can be calculated. Combining location message obtained by SKILL program with the temperature rise of device, temperature distribution graph is found. Finally the result is verified by a complete ANSYS analysis.

Keywords

analogue circuits; circuit CAD; finite element analysis; integrated circuit design; ANSYS analysis; Cadence circuit simulation software; Cadence design software; IC; SKILL language; SKILL program; analog circuit design; electronic parameter; equivalent thermal resistance; finite element analysis software; finite element method; steady-state thermal simulation; temperature distribution graph; Analog circuits; Analytical models; Circuit simulation; Circuit synthesis; Electronic packaging thermal management; Finite element methods; Steady-state; Temperature distribution; Thermal conductivity; Thermal resistance; SKILL language; integrated circuit; temperature distribution; thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Computer Engineering and Technology (ICCET), 2010 2nd International Conference on

Conference_Location

Chengdu

Print_ISBN

978-1-4244-6347-3

Type

conf

DOI

10.1109/ICCET.2010.5485410

Filename

5485410