Random walk algorithm for large thermal RC network analysis

Author

Guo, Jun ; Dong, Sheqin ; Goto, Satoshi

Author_Institution

Northwest Univ., Xi´´an, China

fYear

2009

fDate

20-23 Oct. 2009

Firstpage

771

Lastpage

774

Abstract

The heat diffusion model of IC chip is equivalent to electrical resistors and capacitors (RC) network. Instead of using direct methods to solve the network equations, a novel statistical method based on random walk techniques was proposed for thermal RC network analysis in this paper. The corresponding 2 dimension temperature distribution was derived finally. Experimental results show the simulation results are accurate enough to satisfy the error margin and the proposed method is much faster than the general method for large scale network analysis.

Keywords

RC circuits; network analysis; random processes; statistical analysis; thermal analysis; 2D temperature distribution; IC chip; capacitor network; electrical resistors; heat diffusion model; large thermal RC network analysis; random walk algorithm; statistical method; Algorithm design and analysis; Analytical models; Capacitors; Electric resistance; Equations; Integrated circuit modeling; Large-scale systems; Resistance heating; Statistical analysis; Temperature distribution; Integrated circuit; random walk; simulation; thermal model;

fLanguage

English

Publisher

ieee

Conference_Titel

ASIC, 2009. ASICON '09. IEEE 8th International Conference on

Conference_Location

Changsha, Hunan

Print_ISBN

978-1-4244-3868-6

Electronic_ISBN

978-1-4244-3870-9

Type

conf

DOI

10.1109/ASICON.2009.5351279

Filename

5351279