Title :
Random walk algorithm for large thermal RC network analysis
Author :
Guo, Jun ; Dong, Sheqin ; Goto, Satoshi
Author_Institution :
Northwest Univ., Xi´´an, China
Abstract :
The heat diffusion model of IC chip is equivalent to electrical resistors and capacitors (RC) network. Instead of using direct methods to solve the network equations, a novel statistical method based on random walk techniques was proposed for thermal RC network analysis in this paper. The corresponding 2 dimension temperature distribution was derived finally. Experimental results show the simulation results are accurate enough to satisfy the error margin and the proposed method is much faster than the general method for large scale network analysis.
Keywords :
RC circuits; network analysis; random processes; statistical analysis; thermal analysis; 2D temperature distribution; IC chip; capacitor network; electrical resistors; heat diffusion model; large thermal RC network analysis; random walk algorithm; statistical method; Algorithm design and analysis; Analytical models; Capacitors; Electric resistance; Equations; Integrated circuit modeling; Large-scale systems; Resistance heating; Statistical analysis; Temperature distribution; Integrated circuit; random walk; simulation; thermal model;
Conference_Titel :
ASIC, 2009. ASICON '09. IEEE 8th International Conference on
Conference_Location :
Changsha, Hunan
Print_ISBN :
978-1-4244-3868-6
Electronic_ISBN :
978-1-4244-3870-9
DOI :
10.1109/ASICON.2009.5351279
