• DocumentCode
    2649971
  • Title

    A heuristic method for module sizing under fixed-outline constraints

  • Author

    Zhang, Xiaolin ; Chen, Song ; Piao, Longfan ; Yoshimura, Takeshi

  • Author_Institution
    Grad. Sch. of IPS, Waseda Univ., Kitakyushu, Japan
  • fYear
    2009
  • fDate
    20-23 Oct. 2009
  • Firstpage
    738
  • Lastpage
    741
  • Abstract
    In this paper, a heuristic method for module sizing is proposed as a post-processing of the fixed-outline floorplanning. The heuristic method is based on horizontal and vertical slacks of blocks in the floorplan. By evaluating the distances of each block to the chip boundaries, x-slack and y-slack can be calculated. On the one hand, the heuristic focuses on the blocks has non-zero x-slack or non-zero y-slack but not both. These blocks will be first sorted by the amount of x/y-slack. The block having the most slack will be selected and reshaped, it has a potential to reduce the fixed-outline violation. On the other hand, the heuristic makes use of a marked flag for each block. After reshaping the block, the marked flag of the block will be set to 1. The slack of all the blocks will be recomputed and the focused blocks with marked flag 0 are reselected and sorted. If the set of focused blocks with marked flag 0 is empty, the marked flag of all the blocks will be reset to 0 and repeat the previous steps. If the fixed-outline constraint is not satisfied, we will repeat the procedure with defined maximum iteration number. Experimental results show that, the proposed heuristic could efficient achieve highly success rate without sacrificing much wire-length.
  • Keywords
    heuristic programming; integrated circuit layout; modules; block reshaping; chip boundary; fixed-outline constraints; fixed-outline floorplanning; heuristic method; marked block flag; maximum iteration number; module sizing; x-slack; y-slack; Constraint optimization; Lagrangian functions; Law; Legal factors; Nonlinear equations; Simulated annealing; Transistors; Very large scale integration; White spaces; Fixed-outline floorplanning; module sizing; soft-module;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC, 2009. ASICON '09. IEEE 8th International Conference on
  • Conference_Location
    Changsha, Hunan
  • Print_ISBN
    978-1-4244-3868-6
  • Electronic_ISBN
    978-1-4244-3870-9
  • Type

    conf

  • DOI
    10.1109/ASICON.2009.5351311
  • Filename
    5351311