DocumentCode :
265
Title :
Formation of Vertically Aligned Cobalt Silicide Nanowire Arrays Through a Solid-State Reaction
Author :
Seulah Lee ; Jaehong Yoon ; Bonwoong Koo ; Dong Hoon Shin ; Ja Hoon Koo ; Cheol Jin Lee ; Young-Woon Kim ; Hyungjun Kim ; Taeyoon Lee
Author_Institution :
Sch. of Electr. & Electron. Eng., Yonsei Univ., Seoul, South Korea
Volume :
12
Issue :
5
fYear :
2013
fDate :
Sept. 2013
Firstpage :
704
Lastpage :
711
Abstract :
We report for the first time synthesis of high-density arrays of vertically well-aligned cobalt monosilicide (CoSi) nanowires (NWs) in a large area via a solid-state reaction. The vertical arrays of 1-μm-long Si NWs were first grown on a p-type (1 0 0) Si substrate by the aqueous electroless etching (AEE) method, and a 40-nm-thick Co layer was conformally deposited using a thermal atomic layer deposition system as revealed by SEM and transmission electron microscope analyses. The rapid thermal annealing process was carried out at various temperatures ranging from 700 to 1000 °C; the X-ray diffraction analysis confirmed that the polycrystalline CoSi NW arrays were formed at temperatures above 900 °C. The required high driving force for this silicide formation can be attributed to the significant amounts of oxygen-related contaminants at the defect sites of the highly rough surfaces of AEE-grown Si NWs. To demonstrate practical applications, field emitters and Schottky diodes were fabricated using the vertically aligned CoSi NW arrays. The field emission measurements showed a turn-on field of 10.9 V/μm and a field enhancement factor of 328, indicating the feasibility of vertically aligned CoSi NW arrays as promising field emitters. For the Schottky diodes, the measured Schottky barrier height was 0.52 eV and the estimated ideality factor obtained from the I-V characteristic curves was 2.28.
Keywords :
Schottky barriers; Schottky diodes; X-ray diffraction; atomic layer deposition; cobalt compounds; etching; field emission; nanowires; rapid thermal annealing; scanning electron microscopy; silicon; transmission electron microscopy; AEE method; Co layer; CoSi; I-V characteristic curves; SEM; Schottky barrier height; Schottky diodes; Si; X-ray diffraction; aqueous electroless etching; field emission measurements; high-density arrays; oxygen-related contaminants; p-type Si substrate; polycrystalline CoSi NW arrays; rapid thermal annealing; size 1 mum; size 40 nm; solid-state reaction; temperature 700 degC to 1000 degC; thermal atomic layer deposition; transmission electron microscope; vertically aligned cobalt silicide nanowire arrays; Atomic layer deposition (ALD); Schottky diode; cobalt silicide nanowire; field emission; rapid thermal annealing (RTA); solid-state reaction;
fLanguage :
English
Journal_Title :
Nanotechnology, IEEE Transactions on
Publisher :
ieee
ISSN :
1536-125X
Type :
jour
DOI :
10.1109/TNANO.2013.2268578
Filename :
6542738
Link To Document :
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