DocumentCode
2650905
Title
RF thermal plasma treatment for size reduction and spheroidization of glass powders used in ceramic electronic devices
Author
Seo, J.H. ; Kim, D.U. ; Ju, W.T. ; Nam, J.S. ; Hong, S.H. ; Sohn, S.B. ; Song, S.M.
Author_Institution
Plasnix Co., Incheon
fYear
2006
fDate
4-8 June 2006
Firstpage
376
Lastpage
376
Abstract
Summary form only given. Very fine spherical glass powders are key ingredients in the sintering or package processes to achieve high performance of ceramic electronic devices, such as MLCC (multi layer ceramic capacitor), LTCC (low temperature co-fired ceramics) and PDP (plasma display panel). To provide much finer glass powders with nano-sized spherical shape, a RF (radio-frequency) thermal plasma is employed in our work as a clean heat source for a size-reducing and spheroidizing process of coarse glass powders. As reported earlier by other researchers, very hot flame from thermal plasma generators can easily evaporate refractive materials, and then reduce their size by condensing the droplets rapidly. In our thermal plasma treatment, SEM images and particle size analyzer indicate that most of coarse glass powders with average diameter of 2 mm are reformed into spherical ones with the size of below 300 nm by a high powered 4 MHz RF plasma of 20 kW. The compositions of glass powders before and after the plasma treatment are also compared by an ICP analysis, and they show negligible changes of less than 2% during the RF thermal plasma process, which demonstrates a successful preparation of nano-sized glass powders for the advanced ceramic electronic applications. Further experiments with different operating values of RF power, size of precursor and powder feed rate, are made and operating variable effects on the glass powder characteristics are discussed
Keywords
glass; nanoparticles; particle size; plasma materials processing; scanning electron microscopy; sintering; 2 mm; 20 kW; 4 MHz; RF thermal plasma treatment; SEM; SiO2; ceramic electronic devices; flame; glass powder spheroidization; heat source; low temperature cofired ceramics; multilayer ceramic capacitor; nanosized spherical shape; package processes; particle size analyzer; plasma display panel; refractive materials; sintering; size reduction; thermal plasma generators; Ceramics; Electronic packaging thermal management; Glass; Plasma applications; Plasma devices; Plasma displays; Plasma temperature; Powders; Radio frequency; Rapid thermal processing;
fLanguage
English
Publisher
ieee
Conference_Titel
Plasma Science, 2006. ICOPS 2006. IEEE Conference Record - Abstracts. The 33rd IEEE International Conference on
Conference_Location
Traverse City, MI
Print_ISBN
1-4244-0125-9
Type
conf
DOI
10.1109/PLASMA.2006.1707249
Filename
1707249
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