DocumentCode
2651509
Title
Silicon microfabrication technologies for THz applications
Author
Jung-Kubiak, C. ; Gill, J. ; Reck, T. ; Lee, C. ; Siles, J. ; Chattopadhyay, G. ; Lin, R. ; Cooper, K. ; Mehdi, I.
Author_Institution
Jet Propulsion Lab., California of Technol., Pasadena, CA, USA
fYear
2012
fDate
10-11 June 2012
Firstpage
1
Lastpage
2
Abstract
Silicon micromachining technology is naturally suited for making THz components, where precision and accuracy are essentials. We report here the development of robust micromachining techniques to enable novel active and passive components in the submillimeter-wave region. These features will enable large format submillimeter-wave heterodyne arrays and 3-D integration in the THz region, where fabricating circuits and structures becomes difficult with conventional machining.
Keywords
elemental semiconductors; heterodyne detection; micromachining; radiometers; silicon; Si; THz application; active component; micromachining technique; passive component; radiometer-on-a-chip; silicon microfabrication technology; submillimeter-wave heterodyne array; Etching; Microwave radiometry; Microwave technology; Mixers; Optical waveguides; Receivers; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Silicon Nanoelectronics Workshop (SNW), 2012 IEEE
Conference_Location
Honolulu, HI
ISSN
2161-4636
Print_ISBN
978-1-4673-0996-7
Electronic_ISBN
2161-4636
Type
conf
DOI
10.1109/SNW.2012.6243285
Filename
6243285
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