DocumentCode
2651702
Title
Simultaneous wire sizing and wire spacing in post-layout performance optimization
Author
He, Jiang-An ; Kobayashi, Hideaki
Author_Institution
Silicon Valley Res. Inc., San Jose, CA, USA
fYear
1998
fDate
10-13 Feb 1998
Firstpage
373
Lastpage
378
Abstract
In this paper, we study the wire sizing and wire spacing problem for post-layout performance optimization under Elmore delay model. Both ground capacitance and coupled capacitance in a wire are included in interconnect delay calculation. Combined with general ASIC design flow, we construct section constraint graph in each routing region and use the graph to guide segment sizing and spacing. By defining a cost function to trade-off between interconnect delay and routing area, we formulate wire sizing and wire spacing problem (WSSP) into a constraint-optimization problem and develop a heuristic algorithm to solve it. The preliminary experiments are promising
Keywords
application specific integrated circuits; circuit layout CAD; circuit optimisation; delays; heuristic programming; timing; ASIC design flow; Elmore delay model; constraint-optimization problem; coupled capacitance; ground capacitance; heuristic algorithm; interconnect delay calculation; post-layout performance optimization; section constraint graph; segment sizing; wire sizing; wire spacing; Application specific integrated circuits; Capacitance; Circuit optimization; Cost function; Coupling circuits; Delay; Integrated circuit interconnections; Routing; Timing; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference 1998. Proceedings of the ASP-DAC '98. Asia and South Pacific
Conference_Location
Yokohama
Print_ISBN
0-7803-4425-1
Type
conf
DOI
10.1109/ASPDAC.1998.669503
Filename
669503
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