• DocumentCode
    2651807
  • Title

    The design and test of an MCM-D RF front end for HIPERLAN

  • Author

    Arnold, R.G. ; Faulkner, C.C. ; Pedder, D.J.

  • Author_Institution
    Mitel Semicond., Swindon, UK
  • fYear
    1998
  • fDate
    35920
  • Firstpage
    42552
  • Lastpage
    42557
  • Abstract
    Under the “Hiperion” ESPRIT project, an integrated MCM-D RF front end module for use in the HIPERLAN band has been designed and tested. The module integrates all functions needed to interface between the 5.2 GHz RF band and a 700 MHz IF both in transmit and in receive into a ceramic ball grid array package just 17 mm square. The design uses custom GaAs MMICs, a bipolar silicon prescaler and discrete HEMT transistors, together with filters and matching components realised using embedded passive components within the MCM-D substrate. The design and test of the module is described, together with a revised implementation which uses flipchip ICs and a technique known as direct module attach whereby the module may be directly mounted onto a printed circuit board without the need for a further package
  • Keywords
    multichip modules; 5.2 GHz; 700 MHz; ESPRIT project; GaAs; HIPERLAN; Hiperion; MCM-D RF front end; ceramic ball grid array package; direct module attach; discrete HEMT transistors; flipchip ICs; matching components; prescaler;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Multi-Chip Modules and RFICs (Ref. No. 1998/231), IEE Colloquium on
  • Conference_Location
    London
  • Type

    conf

  • DOI
    10.1049/ic:19980203
  • Filename
    710424