DocumentCode
2652632
Title
Integrated power packaging: trends, driving forces, and restraints
Author
Fishbein, Jeff
Author_Institution
Commercial Integrated Power Eng., Int. Rectifier Corp., El Segundo, CA, USA
fYear
1994
fDate
20-21 Oct 1994
Firstpage
3
Lastpage
15
Abstract
Movement toward integrated power packaging has been occurring for well over a decade. In the past few years in particular, with growing interest in value added and the attention being paid to true system cost, integrated power packaging is broadening in appeal in all major market segments. This approach competes with the traditional discrete component solutions. This paper reviews trends that are contributing to this growing interest and forces pushing for implementation. Also, obstacles inhibiting realization are explored
Keywords
circuit reliability; economics; power electronics; semiconductor device manufacture; semiconductor device packaging; assembly trends; company culture; culture trends; economics; integrated power packaging; package size; package weight; power electronics; reliability; system cost; time factors; Current density; Insulated gate bipolar transistors; Low voltage; MOSFETs; Power semiconductor switches; Schottky diodes; Semiconductor device packaging; Semiconductor devices; Semiconductor diodes; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics in Transportation, 1994. [Proceedings]
Conference_Location
Dearborn, MI
Print_ISBN
0-7803-1839-0
Type
conf
DOI
10.1109/PET.1994.572350
Filename
572350
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