• DocumentCode
    2652632
  • Title

    Integrated power packaging: trends, driving forces, and restraints

  • Author

    Fishbein, Jeff

  • Author_Institution
    Commercial Integrated Power Eng., Int. Rectifier Corp., El Segundo, CA, USA
  • fYear
    1994
  • fDate
    20-21 Oct 1994
  • Firstpage
    3
  • Lastpage
    15
  • Abstract
    Movement toward integrated power packaging has been occurring for well over a decade. In the past few years in particular, with growing interest in value added and the attention being paid to true system cost, integrated power packaging is broadening in appeal in all major market segments. This approach competes with the traditional discrete component solutions. This paper reviews trends that are contributing to this growing interest and forces pushing for implementation. Also, obstacles inhibiting realization are explored
  • Keywords
    circuit reliability; economics; power electronics; semiconductor device manufacture; semiconductor device packaging; assembly trends; company culture; culture trends; economics; integrated power packaging; package size; package weight; power electronics; reliability; system cost; time factors; Current density; Insulated gate bipolar transistors; Low voltage; MOSFETs; Power semiconductor switches; Schottky diodes; Semiconductor device packaging; Semiconductor devices; Semiconductor diodes; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics in Transportation, 1994. [Proceedings]
  • Conference_Location
    Dearborn, MI
  • Print_ISBN
    0-7803-1839-0
  • Type

    conf

  • DOI
    10.1109/PET.1994.572350
  • Filename
    572350