DocumentCode
2652776
Title
Innovative thin film deposition technologies enabling new materials and new device integration roadmaps
Author
Maes, Jan Willem
Author_Institution
ASM, Netherlands
fYear
2011
fDate
4-7 April 2011
Firstpage
101
Lastpage
104
Abstract
Innovative thin film deposition technologies play a key role in new device scaling strategies that are increasingly based on the use of new materials and 3D approaches. Smart tailor-made equipment solutions have enabled processes that were previously considered impossible for volume manufacturing. Examples of atomic layer deposition and epitaxy techniques for logic and memory devices will be presented as well as spin-offs to applications in solar cells and hard disks.
Keywords
atomic layer epitaxial growth; digital storage; hard discs; logic devices; solar cells; thin films; atomic layer deposition; device integration roadmaps; epitaxy method; hard disks; logic devices; memory devices; smart tailor-made equipment solutions; solar cells; thin films; Atomic layer deposition; Conferences; Epitaxial growth; Manufacturing; Sputtering; Three dimensional displays;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronic Test Structures (ICMTS), 2011 IEEE International Conference on
Conference_Location
Amsterdam
ISSN
1071-9032
Print_ISBN
978-1-4244-8526-0
Electronic_ISBN
1071-9032
Type
conf
DOI
10.1109/ICMTS.2011.5976869
Filename
5976869
Link To Document