Title :
An optical multichip module
Author :
Dickinson, Alex ; Downs, M.M.
Author_Institution :
AT&T Bell Lab., Holmdel, NJ, USA
Abstract :
As integrated circuit technology improvements result in increased device speed, designers are forced to adopt new forms of packaging and interconnect such as multichip modules. A description is given of how planar optical interconnect techniques may be combined with a multichip module process to provide optical interconnect within the substrate. Several possible applications of the technology are briefly described
Keywords :
hybrid integrated circuits; integrated circuit technology; optical interconnections; packaging; integrated circuit technology; interconnect; optical multichip module; packaging; planar optical interconnect; substrate; Etching; High speed optical techniques; Multichip modules; Optical interconnections; Optical refraction; Prototypes; Stimulated emission; Substrates; US Department of Energy; Wiring;
Conference_Titel :
Computer Design: VLSI in Computers and Processors, 1991. ICCD '91. Proceedings, 1991 IEEE International Conference on
Conference_Location :
Cambridge, MA
Print_ISBN :
0-8186-2270-9
DOI :
10.1109/ICCD.1991.139955
