DocumentCode
2654122
Title
An optical multichip module
Author
Dickinson, Alex ; Downs, M.M.
Author_Institution
AT&T Bell Lab., Holmdel, NJ, USA
fYear
1991
fDate
14-16 Oct 1991
Firstpage
490
Lastpage
493
Abstract
As integrated circuit technology improvements result in increased device speed, designers are forced to adopt new forms of packaging and interconnect such as multichip modules. A description is given of how planar optical interconnect techniques may be combined with a multichip module process to provide optical interconnect within the substrate. Several possible applications of the technology are briefly described
Keywords
hybrid integrated circuits; integrated circuit technology; optical interconnections; packaging; integrated circuit technology; interconnect; optical multichip module; packaging; planar optical interconnect; substrate; Etching; High speed optical techniques; Multichip modules; Optical interconnections; Optical refraction; Prototypes; Stimulated emission; Substrates; US Department of Energy; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Design: VLSI in Computers and Processors, 1991. ICCD '91. Proceedings, 1991 IEEE International Conference on
Conference_Location
Cambridge, MA
Print_ISBN
0-8186-2270-9
Type
conf
DOI
10.1109/ICCD.1991.139955
Filename
139955
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