• DocumentCode
    2655326
  • Title

    Optimization of temperature-sensitive paint formulation for large-scale cryogenic wind tunnels

  • Author

    Iijima, Yoshimi ; Egami, Yasuhiro ; Nishizawa, Akira ; Asai, Keisuke ; Fey, Uwe ; Engler, Rolf H.

  • Author_Institution
    Nat. Aerosp. Lab., Tokyo, Japan
  • fYear
    2003
  • fDate
    25-29 Aug. 2003
  • Firstpage
    70
  • Lastpage
    76
  • Abstract
    In this paper, a new temperature-sensitive paint (TSP) technique for boundary-layer transition detection in a production-type large cryogenic wind tunnel is present. The formulation of Ru(trpy) based TSP system has been optimized in terms of luminescence intensity and robustness. The optimum dye-binder-solvent combination has been determined through systematic sample tests. A new binder has been introduced and the resulting coating was found free from cracking at cryogenic temperatures. This is contrary to the silicone-based pervious cryogenic TSP that are subject to micro cracks at reduced temperatures. The new TSP can meet the root-mean-square roughness requirement less than 0.15 μm. Experiments in the NAL 0.1-m transonic cryogenic wind tunnel have shown that transition occurs earlier on the unpolished surface than the polished surface, although the roughness value itself increasing by polishing. This suggests that the waviness of the coating could affect on the growth of instability in boundary layers.
  • Keywords
    boundary layers; cryogenics; dyes; luminescence; mean square error methods; optimisation; polishing; stability; temperature sensors; transonic flow; wind tunnels; 0.1 m; boundary layer transition detection; coating; cryogenic temperatures; instability; large scale transonic cryogenic wind tunnels; luminescence intensity; optimization; optimum dye binder solvent; robustness; root mean square roughness; temperature sensitive paint system; Coatings; Cryogenics; Large-scale systems; Luminescence; Paints; Robustness; Rough surfaces; Surface cracks; Surface roughness; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Instrumentation in Aerospace Simulation Facilities, 2003. ICIASF '03. 20th International Congress on
  • Print_ISBN
    0-7803-8149-1
  • Type

    conf

  • DOI
    10.1109/ICIASF.2003.1274854
  • Filename
    1274854