Title :
Dynamic context management for coarse-grained reconfigurable array DSP architecture
Author :
Liu, Yanliang ; Dai, Peng ; Wang, Xin´an ; Zhang, Xing ; Wei, Lai ; Zhou, Yan ; Sun, Yachun
Author_Institution :
Shenzhen Grad. Sch., Peking Univ., Shenzhen, China
Abstract :
This paper proposes a novel technique of dynamic context management scheme for coarse-grained reconfigurable array DSP architecture, which effectively reduces the power consumption and speedup reconfigurable process. The technique permits background loading of configuration data without interrupting the regular execution, overlapping computation with reconfiguration. And stored configurations can be switched dramatically reducing reconfiguration overhead if the next configuration is present in one of the alternate contexts. The proposed technique has been verified in ReMAP (Reconfigurable Multi-media Array Processors) with the Discrete Cosine Transform (DCT) of H.264 and its performance exceed other DSP and multimedia extension architectures by 1.2x to 6.2x. ReMAP was fabricated with SMIC´s 0.18¿m CMOS process mainly for multimedia applications.
Keywords :
CMOS integrated circuits; digital signal processing chips; reconfigurable architectures; system-on-chip; CMOS process; background loading; coarse-grained reconfigurable array DSP architecture; context reuse; context switch; discrete cosine transform; dynamic context management; overlapping computation; partial reconfiguration; reconfigurable multimedia array processors; runtime reconfiguration; size 0.18 mum; system-on-chip; Computer applications; Computer architecture; Digital signal processing; Discrete cosine transforms; Energy consumption; Energy management; Hardware; Runtime; Sun; Switches; Coarse-grained Reconfigurable Array DSP Architecture; Context reuse; Context switch; Partially Reconfiguration; Runtime reconfiguration (RTR);
Conference_Titel :
ASIC, 2009. ASICON '09. IEEE 8th International Conference on
Conference_Location :
Changsha, Hunan
Print_ISBN :
978-1-4244-3868-6
Electronic_ISBN :
978-1-4244-3870-9
DOI :
10.1109/ASICON.2009.5351603