Integrated Optical Circuits Utilizing Surface Mount Photonics Technology

Author

Blauvelt, H. ; Benzoni, A.

Author_Institution

Xponent Photonics

fYear

2006

fDate

12-14 Sept. 2006

Firstpage

54

Lastpage

55

Abstract

In this paper, the surface mount photonics (SMP) approach to optical components is described. SMP adopts many elements of silicon component manufacturing. Key elements of SMP include the use of CMOS foundries for planar lightwave circuit (PLC) fabrication, wafer scale testing of active III-V devices, flip chip bonding of devices using passive alignment, and the use of low cost non-hermetic plastic packaging

Keywords

CMOS integrated circuits; flip-chip devices; integrated circuit bonding; integrated circuit packaging; integrated optoelectronics; optical planar waveguides; plastic packaging; silicon; surface mount technology; wafer-scale integration; CMOS foundries; PLC fabrication; SMP approach; Si; active III-V devices; flip chip bonding; integrated optical circuits; nonhermetic plastic packaging; optical components; passive alignment; planar lightwave circuit fabrication; silicon component manufacturing; surface mount photonics technology; wafer scale testing; CMOS technology; Circuit testing; Foundries; Integrated circuit technology; Integrated optics; Manufacturing; Optical devices; Photonics; Silicon; Surface-mount technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Avionics Fiber-Optics and Photonics, 2006. IEEE Conference

Conference_Location

Annapolis, MD

Print_ISBN

1-4244-0408-8

Type

conf

DOI

10.1109/AVFOP.2006.1707497

Filename

1707497