• DocumentCode
    2655494
  • Title

    A 2.84W 16port Switch ASIC for high performance computing systems

  • Author

    Shen, Hua ; You, Ding-Shan ; Liu, Like ; Yang, Jia ; Jiang, Xiao-Xiao

  • Author_Institution
    ASIC Group, Chinese Acad. of Sci., China
  • fYear
    2009
  • fDate
    20-23 Oct. 2009
  • Firstpage
    54
  • Lastpage
    57
  • Abstract
    The chip´s structure, design trade-off, and physical implementation with power optimization of a 2.84 W switch ASIC, which is targeted for large scale parallel computing systems, are introduced in this paper. The chip supports not only multi-layer, multi-function packet switching with high throughput and low latency, but also provides advanced global barrier process accelerating between its 16 full-duplex ports. At 156.25 Mhz, the chip has 83.2 ns zero-load latency, 80 Gbps port-switching and 240 Gbps internal packet switching capacity with port´s data throughput at 2 × 2.5 Gbps. The ASIC has been taped-out with 0.18 um/6metal CMOS technology, and has about 20 million transistors; 12.39 mm × 12.39 mm die size; with 1053 pin flip-chip package. The first pass silicon of this switch ASIC has successfully passed DFT, functional and system level testing.
  • Keywords
    CMOS digital integrated circuits; application specific integrated circuits; design for testability; flip-chip devices; low-power electronics; packet switching; parallel processing; CMOS technology; design for testing; flip-chip package; frequency 156.25 MHz; functional testing; high performance computing systems; multifunction packet switching; parallel computing systems; port switching; power 2.84 W; power optimization; switch ASIC; system level testing; time 83.2 ns; Application specific integrated circuits; CMOS technology; Delay; Design optimization; High performance computing; Large-scale systems; Packet switching; Parallel processing; Switches; Throughput; DFT; Low Power; Switch; Timing Design;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC, 2009. ASICON '09. IEEE 8th International Conference on
  • Conference_Location
    Changsha, Hunan
  • Print_ISBN
    978-1-4244-3868-6
  • Electronic_ISBN
    978-1-4244-3870-9
  • Type

    conf

  • DOI
    10.1109/ASICON.2009.5351609
  • Filename
    5351609