Title :
Controlled localized heating on integrated circuits for cold-ambient temperature applications
Author :
Dilli, Z. ; Akturk, A. ; Goldsman, Neil
Author_Institution :
Univ. of Maryland, College Park
Abstract :
In this paper, we exploit the 3D-capability of the method to refine simulator resolution to the different material layers of an IC. We have designed and had fabricated ICs with built-in heaters and a temperature sensor array. We use measurement results from these ICs to calibrate our simulator, and investigate the effectiveness of horizontal metal networks and vertical thermal via structures, which have been suggested for the cooling of 3D ICs. We also study the latter method for controlled, localized chip heating.
Keywords :
calibration; chip scale packaging; cooling; integrated circuit design; integrated circuit measurement; semiconductor process modelling; sensor arrays; temperature sensors; thermal management (packaging); 3D IC cooling; IC simulator; built-in heaters; calibration; cold-ambient temperature applications; horizontal metal networks; integrated circuit design; integrated circuit fabrication; localized chip heating; temperature sensor array; vertical thermal-via-structures; Application specific integrated circuits; Circuit simulation; Cooling; Heating; Integrated circuit measurements; Refining; Semiconductor device measurement; Sensor arrays; Temperature control; Temperature sensors;
Conference_Titel :
Semiconductor Device Research Symposium, 2007 International
Conference_Location :
College Park, MD
Print_ISBN :
978-1-4244-1892-3
Electronic_ISBN :
978-1-4244-1892-3
DOI :
10.1109/ISDRS.2007.4422238
