Controlled localized heating on integrated circuits for cold-ambient temperature applications

Author

Dilli, Z. ; Akturk, A. ; Goldsman, Neil

Author_Institution

Univ. of Maryland, College Park

fYear

2007

fDate

12-14 Dec. 2007

Firstpage

1

Lastpage

2

Abstract

In this paper, we exploit the 3D-capability of the method to refine simulator resolution to the different material layers of an IC. We have designed and had fabricated ICs with built-in heaters and a temperature sensor array. We use measurement results from these ICs to calibrate our simulator, and investigate the effectiveness of horizontal metal networks and vertical thermal via structures, which have been suggested for the cooling of 3D ICs. We also study the latter method for controlled, localized chip heating.

Keywords

calibration; chip scale packaging; cooling; integrated circuit design; integrated circuit measurement; semiconductor process modelling; sensor arrays; temperature sensors; thermal management (packaging); 3D IC cooling; IC simulator; built-in heaters; calibration; cold-ambient temperature applications; horizontal metal networks; integrated circuit design; integrated circuit fabrication; localized chip heating; temperature sensor array; vertical thermal-via-structures; Application specific integrated circuits; Circuit simulation; Cooling; Heating; Integrated circuit measurements; Refining; Semiconductor device measurement; Sensor arrays; Temperature control; Temperature sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Device Research Symposium, 2007 International

Conference_Location

College Park, MD

Print_ISBN

978-1-4244-1892-3

Electronic_ISBN

978-1-4244-1892-3

Type

conf

DOI

10.1109/ISDRS.2007.4422238

Filename

4422238