• DocumentCode
    2656568
  • Title

    Microactuator using tensile thin film

  • Author

    Sasaki, Minoru

  • Author_Institution
    Toyota Technol. Inst., Nagoya, Japan
  • fYear
    2009
  • fDate
    9-11 Nov. 2009
  • Firstpage
    608
  • Lastpage
    613
  • Abstract
    The thin film is advantageous for preparing the compliant spring and structures with little mass. The surface micromachining can take these advantages. Since the film structures suffer from the bending generated by the stress imbalance inside, the bulk micromachining is now frequently used. When the tensile stress is introduced in the thin film combining with bulk micromachining, the structural robustness will be obtained. As for the torsion bar, the compliant spring performance can be obtained for the twisting motion keeping the rigidity against the other motions. The potentials are indicated with the micromirror. The performances of the low-voltage driving, temperature stability, possibility for increasing the resonant frequency by decreasing the mass of the moving element, and the wireless driving using the subtle energy generated by the electromagnetic induction are confirmed.
  • Keywords
    bars; microactuators; micromachining; micromirrors; semiconductor thin films; springs (mechanical); surface treatment; tensile strength; bending; bulk micromachining; compliant spring; electromagnetic induction; film structures; low-voltage driving; microactuator; micromirror; resonant frequency; stress imbalance; surface micromachining; temperature stability; tensile stress; tensile thin film; torsion bar; twisting motion; wireless driving; Microactuators; Micromachining; Micromirrors; Resonant frequency; Robustness; Springs; Stability; Temperature; Tensile stress; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro-NanoMechatronics and Human Science, 2009. MHS 2009. International Symposium on
  • Conference_Location
    Nagoya
  • Print_ISBN
    978-1-4244-5094-7
  • Electronic_ISBN
    978-1-4244-5095-4
  • Type

    conf

  • DOI
    10.1109/MHS.2009.5351764
  • Filename
    5351764