DocumentCode
2656568
Title
Microactuator using tensile thin film
Author
Sasaki, Minoru
Author_Institution
Toyota Technol. Inst., Nagoya, Japan
fYear
2009
fDate
9-11 Nov. 2009
Firstpage
608
Lastpage
613
Abstract
The thin film is advantageous for preparing the compliant spring and structures with little mass. The surface micromachining can take these advantages. Since the film structures suffer from the bending generated by the stress imbalance inside, the bulk micromachining is now frequently used. When the tensile stress is introduced in the thin film combining with bulk micromachining, the structural robustness will be obtained. As for the torsion bar, the compliant spring performance can be obtained for the twisting motion keeping the rigidity against the other motions. The potentials are indicated with the micromirror. The performances of the low-voltage driving, temperature stability, possibility for increasing the resonant frequency by decreasing the mass of the moving element, and the wireless driving using the subtle energy generated by the electromagnetic induction are confirmed.
Keywords
bars; microactuators; micromachining; micromirrors; semiconductor thin films; springs (mechanical); surface treatment; tensile strength; bending; bulk micromachining; compliant spring; electromagnetic induction; film structures; low-voltage driving; microactuator; micromirror; resonant frequency; stress imbalance; surface micromachining; temperature stability; tensile stress; tensile thin film; torsion bar; twisting motion; wireless driving; Microactuators; Micromachining; Micromirrors; Resonant frequency; Robustness; Springs; Stability; Temperature; Tensile stress; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro-NanoMechatronics and Human Science, 2009. MHS 2009. International Symposium on
Conference_Location
Nagoya
Print_ISBN
978-1-4244-5094-7
Electronic_ISBN
978-1-4244-5095-4
Type
conf
DOI
10.1109/MHS.2009.5351764
Filename
5351764
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