DocumentCode
2656649
Title
System-on-flexible-substrates: electronics for future smart-intelligent world
Author
Zheng, Li-Rong ; Nejad, Majid B. ; Rodriguez, Saul ; Zhang, Lu ; Chen, Cairong ; Tenhunen, Hannu
Author_Institution
R. Inst. of Technol., Stockholm
fYear
2006
fDate
27-28 June 2006
Firstpage
29
Lastpage
36
Abstract
In this paper, we present architecture, circuit implementation and integration issues of embedded smart systems on flexible substrates for future ubiquitous intelligent world. The work is exampled by several concepts of innovative, self-powered, long-range interconnected radio-frequency identification and sensor networks in warehouse and intelligent goods distribution systems. Two types of RFID concepts are designed for this network. The first one is a self-powered, ultra-low power UWB RFID. A power scavenging system is designed which can draw energy from the 802.11 access point and its surrounding electromagnetic waves. In the second demonstration, we developed a chipless passive RFID based on time-domain reflection principle. As this RFID is chipless and needs only interconnections and antenna, it is potentially fully printable on flexible substrate such as a paper board. Finally, some implementation and experimental results are presented
Keywords
embedded systems; flexible electronics; integrated circuit interconnections; intelligent sensors; radiofrequency identification; substrates; ultra wideband technology; 802.11 access point; RFID concepts; chipless passive RFID; electromagnetic waves; embedded smart systems; flexible substrate; intelligent goods distribution systems; power scavenging system; radio-frequency identification; self-powered UWB RFID; sensor networks; system-on-flexible-substrates; time-domain reflection principle; ubiquitous intelligent world; ultra-low power UWB RFID; Electromagnetic scattering; Flexible printed circuits; Integrated circuit interconnections; Intelligent networks; Intelligent sensors; Intelligent systems; Power system interconnection; Radio frequency; Radiofrequency identification; Sensor systems;
fLanguage
English
Publisher
ieee
Conference_Titel
High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on
Conference_Location
Shanghai
Print_ISBN
1-4244-0488-6
Type
conf
DOI
10.1109/HDP.2006.1707561
Filename
1707561
Link To Document