• DocumentCode
    2656649
  • Title

    System-on-flexible-substrates: electronics for future smart-intelligent world

  • Author

    Zheng, Li-Rong ; Nejad, Majid B. ; Rodriguez, Saul ; Zhang, Lu ; Chen, Cairong ; Tenhunen, Hannu

  • Author_Institution
    R. Inst. of Technol., Stockholm
  • fYear
    2006
  • fDate
    27-28 June 2006
  • Firstpage
    29
  • Lastpage
    36
  • Abstract
    In this paper, we present architecture, circuit implementation and integration issues of embedded smart systems on flexible substrates for future ubiquitous intelligent world. The work is exampled by several concepts of innovative, self-powered, long-range interconnected radio-frequency identification and sensor networks in warehouse and intelligent goods distribution systems. Two types of RFID concepts are designed for this network. The first one is a self-powered, ultra-low power UWB RFID. A power scavenging system is designed which can draw energy from the 802.11 access point and its surrounding electromagnetic waves. In the second demonstration, we developed a chipless passive RFID based on time-domain reflection principle. As this RFID is chipless and needs only interconnections and antenna, it is potentially fully printable on flexible substrate such as a paper board. Finally, some implementation and experimental results are presented
  • Keywords
    embedded systems; flexible electronics; integrated circuit interconnections; intelligent sensors; radiofrequency identification; substrates; ultra wideband technology; 802.11 access point; RFID concepts; chipless passive RFID; electromagnetic waves; embedded smart systems; flexible substrate; intelligent goods distribution systems; power scavenging system; radio-frequency identification; self-powered UWB RFID; sensor networks; system-on-flexible-substrates; time-domain reflection principle; ubiquitous intelligent world; ultra-low power UWB RFID; Electromagnetic scattering; Flexible printed circuits; Integrated circuit interconnections; Intelligent networks; Intelligent sensors; Intelligent systems; Power system interconnection; Radio frequency; Radiofrequency identification; Sensor systems;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-0488-6
  • Type

    conf

  • DOI
    10.1109/HDP.2006.1707561
  • Filename
    1707561