Title :
High performance packaged electronics for the IBM ES9000 mainframe
Author :
Barish, A. ; Eckhardt, J. ; Mayo, M. ; Svarczkopf, W. ; Gaur, S. ; Tummala, R.
Author_Institution :
IBM East Fishkill, Hopewell Junction, NY, USA
Abstract :
An 1100 circuit bipolar gate array and a multi-chip high density glass-ceramic module are described. The chip features multiple logic circuit families built using a modular cell approach. Key features include use of a capacitor for faster ECL delays and the introduction of a 200 mV signal swing differential cascode current switch. The module offers a glass ceramic substrate featuring a dielectric constant of 5.2 and a total of 63 layers of metallization. The cooling capability has been increased to 30 W per chip
Keywords :
IBM computers; bipolar integrated circuits; cooling; logic arrays; mainframes; packaging; substrates; 200 mV signal swing differential cascode current switch; ECL delays; IBM ES9000 mainframe; bipolar gate array; cooling; dielectric constant; glass ceramic substrate; high performance packaged electronics; metallization; multi-chip high density glass-ceramic module; multiple logic circuit families; Capacitors; Ceramics; Delay; Dielectric constant; Dielectric substrates; Electronics packaging; Glass; Logic circuits; Metallization; Switches;
Conference_Titel :
Computer Design: VLSI in Computers and Processors, 1991. ICCD '91. Proceedings, 1991 IEEE International Conference on
Conference_Location :
Cambridge, MA
Print_ISBN :
0-8186-2270-9
DOI :
10.1109/ICCD.1991.139967
