High performance packaged electronics for the IBM ES9000 mainframe

Author

Barish, A. ; Eckhardt, J. ; Mayo, M. ; Svarczkopf, W. ; Gaur, S. ; Tummala, R.

Author_Institution

IBM East Fishkill, Hopewell Junction, NY, USA

fYear

1991

fDate

14-16 Oct 1991

Firstpage

534

Lastpage

539

Abstract

An 1100 circuit bipolar gate array and a multi-chip high density glass-ceramic module are described. The chip features multiple logic circuit families built using a modular cell approach. Key features include use of a capacitor for faster ECL delays and the introduction of a 200 mV signal swing differential cascode current switch. The module offers a glass ceramic substrate featuring a dielectric constant of 5.2 and a total of 63 layers of metallization. The cooling capability has been increased to 30 W per chip

Keywords

IBM computers; bipolar integrated circuits; cooling; logic arrays; mainframes; packaging; substrates; 200 mV signal swing differential cascode current switch; ECL delays; IBM ES9000 mainframe; bipolar gate array; cooling; dielectric constant; glass ceramic substrate; high performance packaged electronics; metallization; multi-chip high density glass-ceramic module; multiple logic circuit families; Capacitors; Ceramics; Delay; Dielectric constant; Dielectric substrates; Electronics packaging; Glass; Logic circuits; Metallization; Switches;

fLanguage

English

Publisher

ieee

Conference_Titel

Computer Design: VLSI in Computers and Processors, 1991. ICCD '91. Proceedings, 1991 IEEE International Conference on

Conference_Location

Cambridge, MA

Print_ISBN

0-8186-2270-9

Type

conf

DOI

10.1109/ICCD.1991.139967

Filename

139967