Effect of bonding parameters on thermosonic flip chip bonding under pressure constraint pattern

Author

Wang, Fuliang ; Li, Junhui ; Han, Lei ; Zhong, Jue

Author_Institution

Sch. of Mech. & Electronical Eng., Central South Univ., Changsha

fYear

2006

fDate

27-28 June 2006

Firstpage

87

Lastpage

89

Abstract

Thermosonic flip chip (TSFC) was performed and studied under the pressure constraint pattern, in which the flip chip is restricted by bonding force. Effects of bonding parameters on bonding strength were studied. Results show that bonding force and ultrasonic power have primary effects on bonding strength. The bonding strength is related to ultrasonic energy used in bonding interface, moderate energy is necessary for high bonding strength, and overabundance or inadequate of energy will cause low bonding strength

Keywords

flip-chip devices; mechanical strength; ultrasonic bonding; bonding force; bonding interface; bonding parameters; bonding strength; pressure constraint pattern; thermosonic flip chip bonding; ultrasonic energy; ultrasonic power; Bonding forces; Connectors; Flip chip; Friction; Light emitting diodes; Packaging; Power engineering and energy; SAW filters; Smart cards; Telecommunications;

fLanguage

English

Publisher

ieee

Conference_Titel

High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on

Conference_Location

Shanghai

Print_ISBN

1-4244-0488-6

Type

conf

DOI

10.1109/HDP.2006.1707571

Filename

1707571