• DocumentCode
    2657069
  • Title

    Wet etched complex three dimensional MEMS structures

  • Author

    Pal, Prem ; Sato, Kazuo

  • Author_Institution
    Dept. of Micro-Nano Syst. Eng., Nagoya Univ., Nagoya, Japan
  • fYear
    2009
  • fDate
    9-11 Nov. 2009
  • Firstpage
    553
  • Lastpage
    558
  • Abstract
    The present research reports the fabrication techniques for the formation of complex three dimensional structures. The process is developed using very economic wet anisotropic etching in pure and surfactant Triton X-100 [C14H22O(C2H4O)n, n= 9-10] added 25 wt% tetramethyl ammonium hydroxide (TMAH) solutions. The structures are fabricated in single and nitride-based silicon on insulator (SOI) Si{100} wafers. In single wafer, both fixed and suspended structures are manufactured, while in SOI wafers only freestanding structures are realized. The present research is aimed to enhance the range of 3D structures fabricated using wet etching.
  • Keywords
    carbon compounds; etching; integrated circuit manufacture; micromachining; micromechanical devices; surfactants; CHO; bulk micromachining; complex three dimensional structures; fabrication techniques; insulator wafers; nitride-based silicon; surfactant Triton X-100; tetramethyl ammonium hydroxide solutions; wet anisotropic etching; Anisotropic magnetoresistance; Fabrication; Manufacturing; Micromachining; Micromechanical devices; Oxidation; Shape; Silicon on insulator technology; Systems engineering and theory; Wet etching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro-NanoMechatronics and Human Science, 2009. MHS 2009. International Symposium on
  • Conference_Location
    Nagoya
  • Print_ISBN
    978-1-4244-5094-7
  • Electronic_ISBN
    978-1-4244-5095-4
  • Type

    conf

  • DOI
    10.1109/MHS.2009.5351788
  • Filename
    5351788