DocumentCode
2657069
Title
Wet etched complex three dimensional MEMS structures
Author
Pal, Prem ; Sato, Kazuo
Author_Institution
Dept. of Micro-Nano Syst. Eng., Nagoya Univ., Nagoya, Japan
fYear
2009
fDate
9-11 Nov. 2009
Firstpage
553
Lastpage
558
Abstract
The present research reports the fabrication techniques for the formation of complex three dimensional structures. The process is developed using very economic wet anisotropic etching in pure and surfactant Triton X-100 [C14H22O(C2H4O)n, n= 9-10] added 25 wt% tetramethyl ammonium hydroxide (TMAH) solutions. The structures are fabricated in single and nitride-based silicon on insulator (SOI) Si{100} wafers. In single wafer, both fixed and suspended structures are manufactured, while in SOI wafers only freestanding structures are realized. The present research is aimed to enhance the range of 3D structures fabricated using wet etching.
Keywords
carbon compounds; etching; integrated circuit manufacture; micromachining; micromechanical devices; surfactants; CHO; bulk micromachining; complex three dimensional structures; fabrication techniques; insulator wafers; nitride-based silicon; surfactant Triton X-100; tetramethyl ammonium hydroxide solutions; wet anisotropic etching; Anisotropic magnetoresistance; Fabrication; Manufacturing; Micromachining; Micromechanical devices; Oxidation; Shape; Silicon on insulator technology; Systems engineering and theory; Wet etching;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro-NanoMechatronics and Human Science, 2009. MHS 2009. International Symposium on
Conference_Location
Nagoya
Print_ISBN
978-1-4244-5094-7
Electronic_ISBN
978-1-4244-5095-4
Type
conf
DOI
10.1109/MHS.2009.5351788
Filename
5351788
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