IC fillet-lifting mechanism on wave soldering after reflow soldering

Author

Izuta, Goro ; Tanabe, Tsuyoshi ; Murai, Junichi ; Murakami, Masaaki ; Suganuma, Katsuaki

Author_Institution

Manuf. Eng. Center, Mitsubishi Electr. Corp., Tokyo

fYear

2006

fDate

27-28 June 2006

Firstpage

182

Lastpage

187

Abstract

Solder joint separation of IC leads is caused by partial melting and displacement of a lead-free solder joint having Pb contamination in process of wave soldering after reflow soldering. An evaluation method of solder joint separation was developed by focusing on the vertical displacement of the joint, which is defined by IC package size and curvature of a printed circuit board (PCB). It has been clarified that the critical displacement causing the solder joint separation is 15 micrometers or less by the model experiment of wave soldering process. Based on the above data, a new in-process measurement tool of PCBs curvature in wave soldering has been developed. The results of practical wave soldering agree well with the model experiment values

Keywords

printed circuit manufacture; reflow soldering; solders; wave soldering; integrated circuit fillet-lifting; printed circuit board; reflow soldering; solder joint separation; wave soldering; Electronics packaging; Environmentally friendly manufacturing techniques; Integrated circuit modeling; Integrated circuit packaging; Lead; Manufacturing industries; Manufacturing processes; Reflow soldering; Scanning electron microscopy; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on

Conference_Location

Shanghai

Print_ISBN

1-4244-0488-6

Type

conf

DOI

10.1109/HDP.2006.1707591

Filename

1707591