The effect of accelerated thermal cycle parameters and the geometry dimensions on solder joint reliability

Author

Hu, Bingting ; Zhou, Jiemin ; Zhou, Ping ; Yang, Ying

Author_Institution

Sch. of Energy Sci. & Eng., Central South Univ., Changsha

fYear

2006

fDate

27-28 June 2006

Firstpage

242

Lastpage

246

Abstract

A simplified BGA flip chip model was established based on Ansys software to investigate thermal stress in the solder joints. The thermal cycle dwell time, thermal cycle temperature range and the maximum dwell temperature were changed to observe their effects on the thermal fatigue life of solder joint; the length and thickness of substrate were also changed to research the dimension effect. The thermal cycle lives were calculated and compared according to two different modified Coffin-Manson equations. The results indicate that the thermal fatigue life decreases with enlarging the thermal cycle dwell time, the thermal cycle range and the maximum dwell temperature. The fatigue life also decreases as the length and thickness of substrate increase. The thermal cycle parameters can be used to accelerate the process of thermal cycle experiment. And the study of dimension effect on thermal fatigue life gave optimization of the package structure

Keywords

ball grid arrays; flip-chip devices; reliability; solders; thermal stress cracking; Ansys software; Coffin-Manson equations; ball grid arrays; flip chip devices; solder joint reliability; thermal cycle dwell time; thermal cycle temperature range; thermal fatigue life; thermal stress; Acceleration; Electronic packaging thermal management; Electronics packaging; Fatigue; Flip chip; Geometry; Joining materials; Soldering; Temperature distribution; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on

Conference_Location

Shanghai

Print_ISBN

1-4244-0488-6

Type

conf

DOI

10.1109/HDP.2006.1707600

Filename

1707600