DocumentCode
2657570
Title
Tin whisker growth under cycling current pulse
Author
Jiang, Bo ; Xian, Ai-Ping
Author_Institution
Inst. of Metal Res., Chinese Acad. of Sci., Shenyang
fYear
2006
fDate
27-28 June 2006
Firstpage
280
Lastpage
284
Abstract
A new test method, called as cycling current pulse method, was developed to evaluate the trend of whisker growth, which the cycling current pulse was first applied for cyclical heating and cooling on the tin coating sample in order to accelerate the whisker growth. The loading current in samples was controlled by the device composed of alpha-simple applied controller and a constant current source, and the working current density varied from 5 times 104A/dm2 to 10 times 104A/dm2. It resulted in temperature of the samples varied from 40 degC to 75 degC, and both heating and cooling dwell time per cycle were 5 min, 0-2200 cycles (about 15 days) were carried out in present work. Tin whisker growth on surface finish is observed by SEM after different cycles; the results showed that the longest fluted whisker about 120 microns in length was observed after 2200 cycles current pulse test. As a comparison with the isothermal condition, there was a relative short incubation period in cycling current pulse test at current density 5 times 104A/dm2. However, at current density of 10 times 104A/dm2, whisker growth was slowdown, the reason is not clear now. Present work shows that the cycling current pulse method is effective to evaluate the trend of whisker growth
Keywords
materials testing; surface finishing; whiskers (crystal); 120 microns; 40 to 75 C; 5 min; constant current source; cyclical cooling; cyclical heating; cycling current pulse test; isothermal condition; whisker growth; Coatings; Cooling; Current density; Heating; Isothermal processes; Life estimation; Surface finishing; Temperature; Testing; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on
Conference_Location
Shanghai
Print_ISBN
1-4244-0488-6
Type
conf
DOI
10.1109/HDP.2006.1707607
Filename
1707607
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