Embedded sensors for mechanical stress monitoring in copper damascene interconnects

Author

Delamare, R. ; Kasbari, M. ; Rivero, Ch ; Blayac, S. ; Inal, K.

Author_Institution

Centre de Microelectronique de Provence, Gardanne

fYear

2007

fDate

12-14 Dec. 2007

Firstpage

1

Lastpage

2

Abstract

A novel concept and related testing methodology of a sensing device is presented. This sensor is used to monitor the local intrinsic stresses induced in wafer processes. The main purpose of this abstract is to illustrate the power of the sensor as strain probe: the challenge is to correlate the electrical sensors signal directly to stress variation. This is demonstrated through an example where we propose to investigate the residual stress in the copper damascene lines.

Keywords

copper; electric sensing devices; integrated circuit interconnections; integrated circuit measurement; internal stresses; strain sensors; stress measurement; wafer-scale integration; Cu; copper damascene interconnects; electrical sensors; embedded sensors; local intrinsic stresses; mechanical stress monitoring; residual stress; strain probe; wafer processes; Bridge circuits; Copper; Educational institutions; Mechanical sensors; Metals industry; Monitoring; Probes; Residual stresses; Resistors; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Device Research Symposium, 2007 International

Conference_Location

College Park, MD

Print_ISBN

978-1-4244-1892-3

Electronic_ISBN

978-1-4244-1892-3

Type

conf

DOI

10.1109/ISDRS.2007.4422311

Filename

4422311