DocumentCode :
2657944
Title :
A novel design and fabrication method of scanning micro-mirror for retinal scan displays
Author :
Cohen, Omer ; Nemirovsky, Yael
Author_Institution :
Fac. of Electr. Eng., Technion-Israel Inst. of Technol., Haifa, Israel
fYear :
2004
fDate :
13-15 Dec. 2004
Firstpage :
467
Lastpage :
470
Abstract :
In this paper, we present a novel scheme for designing and fabricating a single axis scanning micro mirror. The device is the match of two chips using a flip chip bonder. In this paper, we describe mostly the top chip that includes the reflecting surface. The device is very low cost and electrostatically actuated with a relatively low voltage. We present the fabrication process scheme, based on wet etching of silicon wafers. We also present the motivation to use thin wafers, as much as 50 μm thick, to reach a resonant frequency of 15-30 kHz, suitable for raster scanners such as retinal scan displays. Finally, we present a preliminary prototype produced by such a process.
Keywords :
electrostatic actuators; etching; flip-chip devices; microdisplays; micromirrors; optical scanners; resonance; 15 to 30 kHz; 50 micron; chip reflecting surface; flip chip bonding; low voltage electrostatic actuated mirror; raster scanners; resonant frequency; retinal scan displays; single axis scanning micro mirror; thin wafers; wet etching; Costs; Design methodology; Displays; Fabrication; Flip chip; Low voltage; Mirrors; Retina; Wafer bonding; Wet etching;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics, Circuits and Systems, 2004. ICECS 2004. Proceedings of the 2004 11th IEEE International Conference on
Print_ISBN :
0-7803-8715-5
Type :
conf
DOI :
10.1109/ICECS.2004.1399719
Filename :
1399719
Link To Document :
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