• DocumentCode
    2658115
  • Title

    Three-dimensional nano electronics by dielectrophoretic assembly on a flexible substrate

  • Author

    Chen, Chia-Ling ; Chao, Shih-Hsien ; Selvarasah, Selvapraba ; Dokmeci, Mehmet R.

  • Author_Institution
    Northeastern Univ., Boston
  • fYear
    2007
  • fDate
    12-14 Dec. 2007
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    In this paper, we demonstrate three-dimensional assembly of nanoscale materials, including single-walled and multi-walled carbon nanotubes and Au nanoparticles on a flexible parylene-C substrate. The assembly technology combines top down fabrication (fabrication of the three-dimensional microplatform) and bottom up dielectrophoretic (DEP) assembly of different nanomaterials.
  • Keywords
    carbon nanotubes; electrophoresis; flexible electronics; gold; nanoelectronics; nanoparticles; polymers; Au; dielectrophoretic assembly; flexible parylene-C substrate; multiwalled carbon nanotubes; nanoparticles; single-walled carbon nanotubes; three-dimensional nano electronics; three-dimensional nanoscale materials assembly; Assembly; Biosensors; Bridges; Dielectrophoresis; Electrodes; Fabrication; Gold; Nanobioscience; Nanoparticles; Nanostructured materials;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Device Research Symposium, 2007 International
  • Conference_Location
    College Park, MD
  • Print_ISBN
    978-1-4244-1892-3
  • Electronic_ISBN
    978-1-4244-1892-3
  • Type

    conf

  • DOI
    10.1109/ISDRS.2007.4422332
  • Filename
    4422332
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2658115