• DocumentCode
    2658377
  • Title

    ISFET CMOS compatible design and encapsulation challenges

  • Author

    Sudakov-Boreysha, Liby ; Morgenshtein, Arkadiy ; Dinnar, Uri ; Nemirovsky, Yael

  • Author_Institution
    Dept. of Biomed. Eng., Technion-Israel Inst. of Technol., Haifa, Israel
  • fYear
    2004
  • fDate
    13-15 Dec. 2004
  • Firstpage
    535
  • Lastpage
    538
  • Abstract
    This work presents the main challenges in ISFET encapsulation. It analyzes SU8 drawbacks as an encapsulant and presents a novel flip-chip bonding packaging concept.
  • Keywords
    CMOS integrated circuits; encapsulation; flip-chip devices; ion sensitive field effect transistors; semiconductor device packaging; ISFET CMOS compatible design; ISFET encapsulation; ISFET fabrication; SU8 encapsulant; flip-chip bonding packaging concept; Bonding; CMOS technology; Electrodes; Encapsulation; Fabrication; MOSFETs; Packaging; Sensor phenomena and characterization; Silicon; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics, Circuits and Systems, 2004. ICECS 2004. Proceedings of the 2004 11th IEEE International Conference on
  • Print_ISBN
    0-7803-8715-5
  • Type

    conf

  • DOI
    10.1109/ICECS.2004.1399736
  • Filename
    1399736
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2658377