Thermal design of a high power telecommunication system using a CFD tool

Telecommunication equipment with high power density and high power consumption should be cooled sufficiently enough for its stable operation and reliability. For the thermal management of a high power telecommunication system, electronic components temperature field and cooling air flow field are simulated by a CFD program. Two levels of thermal modeling are applied due to both computational cost and complexity of the problem. To show the validity of the thermal analysis results, experimental verification is performed to compare with the simulation results.